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Tri-M will continue to invest in the latest state-of-art equipment to enhance our manufacturing capabilities.

Our Process Capabilities includes :-


 SMT (Panasert & Fuji lines)

 PTH/Radial/Axial

 0402/0201 Chip Mounting

 BGA/COB/CSP Assembly

 On-Line AOI

 Selective Wave soldering process

 Lead-free soldering process

 Conformal Coating

 ICT / FCT C Hardware /Software Development

 CDMA & GSM Testing

 Box-Build / Complete System / Burn-In

 Equipment & System Integration

 On-Line ERP System

 

PCB Assembly

Tri-M Technologies offers a full solution for all PCB Assembly and testing requirements. We use the latest technology in both the manufacturing and the testing of complex printed circuit boards. Our programs include product applications in the high-end video and audio product, telecommunications, networking, optical, and high-end computer systems markets. We focus on time-to-market and on providing the most cost effective solution. Our global manufacturing and engineering staff is available to support your design, prototype and production requirements. With our existing facilities, Tri-M Technologies can provide a scalable manufacturing solution tailored to specific product and logistic demands.

>>sample PCBA products

 

Box-build Assembly

We have close working relationships with Key Commodity suppliers to assure success in box-build assembly.

 Strategic relationship with plastic, casting, stamping, flex circuits, cable harness, connectors and IC component suppliers

 Concurrent and Value Engineering

 System Integration

 Retail Packaging

>>sample Box-build products

 

Equipment & System integration

This is a newly set up division. We build, assemble & test equipment and systems to serve our new customers in this semiconductor industry. We also provide turnkey business for our customers.

>>sample ESI products


 

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